Four new semiconductor manufacturing projects totaling ₹4,594 crore have been approved by the Indian Union Cabinet in the states of Andhra Pradesh, Punjab, and Odisha.
Information and Broadcasting Minister Ashwini Vaishnaw made the announcement on August 12, 2025. This move is a component of the India Semiconductor Mission, which has set out ₹76,000 crore to support chip manufacturing facilities throughout the nation.
Two of these new projects will be in Odisha, more precisely in the Info Valley, which is becoming a semiconductor hub in Bhubaneswar. SiCSem Pvt Ltd.’s first project entails the establishment of the first commercial compound semiconductor production plant in India, which will produce silicon carbide (SiC) devices.
This facility will be able to package 96 million units and create 60,000 wafers a year. Electric vehicles, railroads, rapid chargers, solar inverters, defense systems, and data centers are just a few of the important industries that this factory will provide. This project has a ₹2,066 crore investment.
Supported by funding from prominent US technology companies including Intel and Lockheed Martin, the second project in Odisha will be a 3D Glass semiconductor packaging and embedded glass substrate manufacturing facility by 3D Glass Solutions Inc.
With the use of cutting-edge semiconductor packaging technology, this facility will produce 13,200 3D Heterogeneous Integration modules, 50 million assembled units, and 69,600 glass panel substrates yearly. This requires a ₹1,943 crore investment.
The Cabinet authorized Advanced System in Package Technologies Pvt Ltd to establish a chip packaging plant in Andhra Pradesh with a ₹468 crore investment. With uses in mobile phones, set-top boxes, automotive electronics, and other electronic devices, this unit will be able to produce 96 million units annually.
Continental Device India Pvt. Ltd. (CDIL), which was approved for a project involving an expenditure of ₹117 crore, will expand its semiconductor manufacturing operations in Punjab. This plant will produce silicon and silicon carbide transistors, MOSFETs, IGBTs, and Schottky bypass diodes, among other high-power discrete semiconductor devices.
Approximately 158.38 million units will be produced annually. The devices will be used in power conversion, industrial applications, renewable energy systems, automotive electronics, including electric vehicles and charging infrastructure, and communication infrastructure.
With a total of ten projects approved across six states and a combined expenditure of over ₹1.6 lakh crore, these four projects complement the already-existing semiconductor initiatives under the India Semiconductor Mission.
Over 2,000 skilled jobs are anticipated to be directly created by the new projects, which would also greatly improve India’s semiconductor manufacturing ecosystem and its competitiveness in the world market for cutting-edge technology.
